ISTFA 2021 - ASM International
5 709,00 CZK
Průměrná cena
5 709,00 CZK
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Popis produktu
The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.
Specifikace
- Stav: new
- Typ produktu:Knihy > Cizojazyčná literatura > English literature > Nonfiction > Science
- GTIN/EAN: 9781627084192