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The theme for the 2021 conference was System-in-Package (SiP) technology. Papers include discussions on board and system level failure analysis; detecting counterfeit microelectronics; emerging failure analysis techniques and concepts; future challenges of failure analysis; and scanning probe analysis.

Specifikace

• Stav: new
• Typ produktu:Knihy > Cizojazyčná literatura > English literature > Nonfiction > Science
• GTIN/EAN: 9781627084192

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